AzizAziz is Of Counsel to the firm (licensed in NY, CT, D.C., and the USPTO) and brings significant experience in Intellectual Property Law, including over 12 years with IBM Corp. as a Senior Attorney and Patent Team Leader. He has also worked for the Patent Dept. of Union Carbide Corp. and Honeywell Corp. Prior to joining the legal profession he worked as an Engineer

Aziz’s Intellectual Property law experience includes: Preparation and prosecution of domestic and international patent applications in the software, Internet, business methods, telecommunication, wireless, mobile devices, semi-conductor processing, packaging and interconnect arts, automotive components and devices, industrial tools and devices, mechanical & material arts, electro-mechanical switches and actuators, optics and light electrical arts; Patent & trademarks searches and opinions; Writing infringement and patentability opinions; Prior art and other legal research; Client counseling, drafting & negotiating contracts and licenses; Patent & trademark clearance of products; Patent portfolio mapping & strategy; Trademarks searches and opinions; and Management of outside attorneys in patent preparation and prosecution; providing legal service to various organization.

Aziz has been a recipient of numerous honors and awards. Mr. Ahsan has written for many publications, including two sections in the award-winning book “The Hudson Valley, Our Heritage, Our Future”.

William Mitchell College of Law, J.D. (1985)
University of Minnesota, MBA, Marketing, Management, and Finance (1981)
University of Minnesota M.S. Mechanical Engineering (1978)
University of Minnesota B.S., cum laude, Aeronautical Engineering, Sigma Gamma Tau (1976)

Professional Experience
Kenyon & Kenyon LLP, Senior Associate
IBM Corporation, Senior Attorney, IP Law
Union Carbide Corporation, Patent Attorney
Honeywell, Inc., Patent Associate
Dorsey & Whitney LLP, Patent Legal Assistant

Bar Memberships
New York
District of Columbia
Registered to practice before the U.S. Patent and Trademark Office

Co-inventor, U.S. Patent No. 5,912,831
Co-inventor, U.S. Patent No. 5,673,216
Co-inventor, U.S. Patent No. 5,481,357
Co-inventor, U.S. Patent No. 5,251,806
Co-inventor, U.S. Patent No. 5,130,779
Co-inventor, U.S. Patent No. D483,920
Co-inventor, U.S. Patent No. D494,728
Co-inventor, U.S. Patent No. 5,912,831

Technical Published
A Novel Process for the Fabrication of Corrosion Free Multi-Layer Metal Conductor Structures for I/O Pin Interconnection, ISHM (Int’l Society for Hybrid Metallurgy), NEPCON WEST, pages 1737-1750, CA, 1994
Helicopter Rotor Radius Optimization, AIAA Paper No. 79-0554, NY, 1979.

E: [email protected]

Privacy Settings
We use cookies to enhance your experience while using our website. If you are using our Services via a browser you can restrict, block or remove cookies through your web browser settings. We also use content and scripts from third parties that may use tracking technologies. You can selectively provide your consent below to allow such third party embeds. For complete information about the cookies we use, data we collect and how we process them, please check our Privacy Policy
Consent to display content from Youtube
Consent to display content from Vimeo
Google Maps
Consent to display content from Google